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Leading fiber optics and photonics manufacturers are constantly looking to more rapidly and precisely cure the adhesives that bond and hold their fiber optic or electro optic components together.
When adhesives are cured consistently independent of the operator or automated assembly station, manufacturers can achieve better control and optimize their production process leading to higher yields and lower costs at the bonding stations.
The iCure microprocessor-based thermal spot curing system improves productivity in benchtop assembly processes and increases yields in automated and semi-automated operations by delivering precise and accurate thermal energy through one fully integrated, compact tabletop unit. This results in a repeatable cure - every time. The system allows for the use of thermal adhesives where only UV curable were available thereby increasing the long term reliability of the optical components.
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